A new family of ECL devices is targeted at OC-48 grade applications such as routers, switches and 3G basestations where jitter management is a critical issue in overall system performance
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ON Semiconductor has released three ECLinPS MAX devices - the first members of a new family of emitter coupled logic (ECL) devices targeted at OC-48 grade applications such as routers, switches and 3G basestations where jitter management is a particularly critical issue in overall system performance.

The ECLinPS MAX devices offer 200fs typical jitter performance and are targeted specifically at clock distribution functions, a major source of signal distortion in these types of high-speed communications systems.

“Every high-speed serial link designer struggles to meet a total jitter budget”, said Dr Howard Johnson, noted author of “High-speed digital design: a handbook of black magic” and “High-speed signal propagation: advanced black magic”, a signal integrity columnist for EDN, and a technical workshops instructor for digital engineers at Oxford University.

“Anything that provides more margin in that budget helps”.

“Low-jitter clock distribution definitely relieves pressure on the jitter budget - making the rest of the design that much easier”.

The ECLinPS MAX family of devices offer a highly flexible means to route clock and data signals through ultra precise system designs and across backplanes, functioning as translators, receiver/drivers and clock distribution products.
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The outstanding jitter performance of the devices allows designers to: increase the depth of their clock trees while staying well within jitter budgets; minimise the possibility of incorrect data latching; increase likelihood of maintaining lock on clock sources; and improve the speed of obtaining lock after a field board swap.

The NB6L11 1:2 differential fan-out buffer is ideal for applications requiring very fast AC performance and features 160ps typical propagation delay and supports input clock frequencies greater than 6GHz and maximum input data rates typically greater than 6Gbit/s.

Typical RMS jitter for this device is 200fs.

The NBL16 1:1 differential fan-out buffer offers similar input clock and data range specs and has an input propagation delay spec of 135ps.

With output transition times of 70ps it is ideally suited for interfacing with high-frequency and low-voltage (2.5V) sources.

Typical RMS jitter for this device is 200fs.

The NB6L239 differential clock divider is an advanced clock distribution IC with dual divider outputs, allowing for two separate clock signals to be distributed from a single reference input.

The first division bank offers divide by 1, 2, 4, and 8 ratios while the second provides divide by 2, 4, 8, and 16 ratios.

This allows an external 622MHz reference to be used to generate 38.8 to 622MHz outputs.

Additionally, the NB6L16 and NB6L11 are pin-for-pin upgradeable from their predecessor ECLinPS Plus versions.

Increasingly, networking and server designers are forced to make trade-offs between excellent jitter performance and affordability in their choice of ECL devices.

The new ECLinPS MAX family of products delivers AC performance - specifically outstanding jitter and skew that is closer to ON Semiconductor’s industry leading, highest performance silicon-germanium-based GigaComm devices, but at a price-point much closer to the company’s standard bipolar ECLinPS Plus family.

As an added benefit to designers with limited power budgets, the new devices consume up to 50% less power than the company’s highest performing devices.

The NB6L11 and NB6L16 are packaged in the 8-pin, SOIC package and priced at $3.55 per unit in 10,000 unit quantities.

The NB6L239 is available in a 16-pin QFN that measures 3 x 3mm and priced at $4.60 per unit in 10,000 unit quantities.

Fairchild Semiconductor has released a number of 4, 6 and 8-bit LCX and VCX series low-voltage logic functions in the DQFN form factor
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Fairchild Semiconductor has released a number of 4, 6 and 8-bit LCX and VCX series low-voltage logic functions in the DQFN (depopulated very thin quad flat-pack no leads) form factor. DQFN, the industry’s smallest package for quad, hex and octal logic functions, represents a 75% space savings over traditional TSSOP (thin shrink small outline package) devices.

DQFN is the optimal solution for facilitating feature additions in next-generation cellphones, digital cameras, camera-phones and other ultraportable battery-powered applications.

DQFN provides a number of important design benefits.

Noise and crosstalk between I/O terminals is reduced compared to leaded packages due to the lower capacitance and inductance of DQFN.

Chips in DQFN also run cooler than in leaded packages due to the exposed die attach paddle underneath.

DQFN has visible solder joints that facilitate easy inspection.
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DQFN packaged logic is second-sourced for assured supply.

“DQFN’s smaller form factor enables more compact designs”, says Ken Murphy, Fairchild’s Marketing Manager for Logic Products.

“For example, the 74LCX138BQX decoder/demultiplexer in DQFN can expand the available control signals from the microprocessor to the LCD display and LED drivers for MP3 players, while conserving space”.

Currently available LCX and VCX series devices in DQFN include: the 74LCX245BQX 2.5 to 3.3V bidirectional octal transceiver with 5V tolerant inputs and outputs; the 74LCX244BQX 2.5 to 3.3V octal buffer line driver with 5V tolerant I/O; the 74LCX138BQX 2.5 to 3.3V (1-of-8) decoder/demultiplexer with 5V tolerant I/O; the 74VCX08BQX 1.2 to 3.3V quad dual-input AND gate with 3.6V tolerant inputs; and the 74VCX245BQX 1.4 to 3.3V bidirectional octal transceiver with 3.6V tolerant inputs.

Fairchild’s LCX and VCX logic functions are fabricated with an advanced CMOS technology to achieve high-speed operation while maintaining low power dissipation.

All models implement the company’s patented noise/EMI reduction circuitry and support live insertion/withdrawal.

Electrostatic discharge (ESD) performance is exceptional, with machine and human body models rated at greater than 200 and 2000V, respectively.

All part numbers are available in 3000-piece tape reel formats compatible with high-speed manufacturing processes.

The introduction of these low-voltage logic products in DQFN further expands Fairchild’s innovative package offering that includes FLMP, MicroPak and BGA form factors.

These lead-free (Pb-free) products meet or exceed the requirements of the joint IPC/JEDEC standard J-STD-020B and are compliant with the European Union requirements that will take effect in 2005.

A new family of PC clock devices targets next-generation desktop PC platforms for the performance and mainstream markets
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The product family includes the industry’s first four-PLL-based PC clock device (CV115C) for these markets, enabling complete and independent control of key clock circuits within the system thereby resulting in increased flexibility and system performance. More specifically, the new IDT CV115C is the only product on the market to offer independent clocking for PCI Express, making it an appropriate fit for next-generation desktop PC platforms.

In addition to independent clocking for PCI Express, the IDT CV115C PC clock also offers independent clocking of CPU, SATA (Serial ATA) and USB interfaces, allowing each clock to be individually optimised within the system, resulting in superior performance.

A new VDD-suspend pin allows programming to be maintained in power-down mode, with power consumption less than 1mA.

The IDT CV115C architecture also incorporates programming that enables a linearly scalable frequency adjustment as opposed to the commonly used discrete stepping approach, allowing enthusiasts the ability to fine-tune their system for better performance.
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In addition, with independent spread-spectrum control (SSC), each of the three SSC-capable PLLs within the device can be programmed independently to reduce EMI within the system.

“IDT has delivered a four PLL-based PC clock, offering features and benefits that complement the performance requirements of our next-generation Intel Desktop Boards”, said Mark Shipman, Director, Intel Desktop Board Operations.

“We are pleased to provide this new capability to our customers”.

IDT also unveiled a suite of three-PLL-based PC clocks (CV110J, CV123B) that are also targeted at the next-generation desktop PC market.

ON Semiconductor has expanded its 100-plus MiniGate portfolio with a series of new sub-1V logic devices in tiny SOT-553 packaging
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Delivering operating voltages of 0.9 to 3.6V and ultralow propagation delay time as low as 1.5ns, these devices are ideal for portable and consumer electronics applications such as cellphones, MP3/MPEG-4 players and portable video equipment. “Our customers are demanding ultralow operating voltage, for low power consumption and are unwilling to sacrifice speed or drive characteristics”, said Dan Huettl, ON Semiconductor Director of Standard Logic Products.

“The small footprint leaded package of the NL17SVxxXVT52 devices enables the use of the same visual/mechanical inspection equipment set that nearly all manufacturers currently have in place, without sacrificing speed, drive, small size or ease of assembly”.

ON Semiconductor is the first supplier to introduce logic gates with both sub-1V operating voltage and high-speed performance in the industry’s smallest leaded logic gate package.

The new NL17SVxxXV5T2 single gate sub-1V family is available in the five-leaded SOT-553 surface mount package.

All six of the newly released devices are fully specified to operate as low as 0.9V.

The SOT-553 package - which measures only 1.6 x 1.6 x 0.6mm - offers the smallest footprint of any 1.0V logic family in a leaded package.

The SV family offers a wide operating voltage (0.9 to 3.6V), extremely small propagation delay of less than 2.0ns at 3.0V.

The devices deliver a very strong drive capability (+/-24mA at 3.3V) and are lead (Pb) free.

The devices are priced at $0.14 per unit in 10,000 unit quantities.

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Eight new NanoSwitch digital bus switch products are ideally suited to address the operational requirements of next generation servers, RAID, Super VGA, memory bank switching, and high-performance networking/telecomms backplanes. The PI3CH family of low-voltage (2.5/3.3V), high-bandwidth (500MHz) bus switches offer expanded performance capabilities that meet the challenges of advanced performance communication buses like PCI-X, as well as emerging DDR-I / DDR-2 memory standards, and also simplifies the I/O migration from parallel to serial differential signalling standards.

Key performance features in this product family include very flat on-resistance (5ohm - flat) across the full device bandwidth, and very low on/off capacitance (5-10pF) that enables the switches to be used in applications to reduce bus loading.

The 5V I/O tolerance and beyond rail-to-rail capability makes the PI3CH switches ideal for bridging legacy 5V I/O based platforms to next generation 2.5/3V systems.

“Pericom’s number-one position in digital bus switches over the past two consecutive years has provided us with an intimate perspective on the industry, and has enabled us to focus our technology to help drive unparalleled performance levels”, explained Jeff DeAngelis, Director of Product Marketing.
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“This product line extension helps rejuvenate the design engineer’s toolbox by offering new performance alternatives never believed possible in digital bus switch technology”.

Key features include: high signal passing bandwidth (500MHz); beyond rail-to-rail switching; 5V tolerant I/O with 3.3V supply; 2.5 and 3.3V supply voltage operation; hot-insertion capable; industrial operating temperature -40 to +85C; and lead-free packaging available.

Free product samples, datasheets, Ibis models, technical support, product presentation, and application note are available today on the company website.

The devices are housed in a variety of performance and space saving packaging ranging from TSSOP to ultracompact TDFN.

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The new technology is based on thermoplastic bodies, manufactured by free forming, such as selective laser sintering (SLS) or fused deposit modelling (FDM). The metal circuits are applied by metal foil hot embossing. The foils can range in thicknesses from 10 to more than 100um. A range of plastics can be used with up to +250C temperature resistance.

Linewidths can be manufactured from 0.2mm and upwards, and the clearance between circuits may be as close as 0.2mm.

The only geometric limitation in 3D is no sharp corners.

The new technology allows new concepts in electronics design.

Instead of using conventional printed circuit boards it is now possible to incorporate electronics in plastics with other functions.

This can save component numbers, weight and cost, increasing reliability and giving designers more freedom.

Invotec Group has won a prestigious award from BAE Systems for its manufacturing site in Tamworth, Staffordshire
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The site is one of the first suppliers to BAE Systems Avionics sector to have achieved the award. As Europe’s largest manufacturer of time-critical, high-technology printed circuit boards, Invotec is honoured to achieve such an accolade from BAE Systems, one of the most respected companies in the UK.

Following a year of strict analysis and quality improvement projects, Invotec was presented with BAE Systems’ Bronze trophy for the Supplychain Excellence Programme in a special ceremony held at Invotec’s Tamworth plant on Friday 24th October 2003.

The Supplychain Excellence Programme has been in operation since the early 1990s and is intended to create partnerships with strategic supply chains to facilitate ongoing joint improvements.

Planning and proactive engagement with the supplier is applied in order to deliver an excellence approach through business and manufacturing assessment.

David Jones, Chief Executive, Invotec said: “BAE Systems in Rochester contacted Invotec about 15 months ago and invited us to join the Supplychain Excellence Programme.

Only ’strategic’ suppliers are invited to join the programme which is basically a scheme where they ‘help us to help ourselves’ and to follow a path of continuous improvement.
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We were absolutely delighted when they informed us that we had achieved the Bronze level of excellence, particularly as we are one of the first suppliers to BAE Systems Avionics to do so”.

Suppliers are selected on their strategic importance to BAE Systems and joint improvement activities are based on the output of the supplier assessment.

Assessments are carried out by a multidisciplinary team, and monitored regularly against a time-based plan.

Performance improvements in quality, delivery and relationship are measured and savings determined against a cost reduction plan.

Achievement by the supplier of performance targets leads to recognition via awards.

Jones continued: “BAE Systems launched the assessment in the summer of 2002, with an intensive three day audit of the management and business systems at Tamworth.

A report was then issued, highlighting the main areas for improvement in manufacturing and business processes.

Invotec devised an improvement plan known internally as ‘Project Endeavour’ which has now been successfully implemented”.

“Project Endeavour involved all 150 employees and ‘took people back to basics’ with rudimentary retraining on quality tools and techniques.

Employees were encouraged to take responsibility for minimising material wastage, and organising their own working areas.

Endeavour has been an outstanding success for Invotec and will be continued in the future”.

Other significant areas of improvement included business communications for both internal and external audiences.

Invotec implemented a programme of both customer and employee questionnaires - this will now take place biannually.

One year on, a second assessment confirmed to BAE Systems that Invotec had reached the Bronze standard of efficiency.

Sue Wood, MD, BAE Systems Avionics Systems commented: “It is a credit to the achievements made by Invotec (Tamworth) that it is to receive the BAE Systems Supplychain Excellence Bronze award.

Invotec is one of the selected ’strategic suppliers’ to BAE Systems invited to join the Supplychain Excellence Programme.

We look forward to continued development of our relationship using the Supplychain Excellence Programme to realise further business benefits to mutual advantage”.

Jones added: “The programme is certainly a challenge and we have found the process both hard work and rewarding, the benefits are multifaceted as it has helped us to examine the internal workings of the Tamworth site through external eyes.

We have implemented changes that will improve efficiency for all our customers and this level of attainment will also be recognised by other organisations”.

“We are looking forward to working towards the Silver, the emphasis will be more on manufacturing and we will need to improve initiatives with our own suppliers - so look out.

We believe that we can realistically achieve it by Autumn 2004 - no company has achieved the Silver award yet and Invotec would like to be the first”.

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Labtech, based in Presteigne, Mid Wales, is linking up with Pioneer Circuits, of Santa Ana, California, which manufactures rigid, flexible and rigid-flex printed circuit boards. The new alliance, a noncompetitive agreement, allows both companies to promote each other in specific territories by using existing sales channels.

Pioneer will promote Labtech’s core capabilities to the North American space and defence markets and Labtech will reciprocate by promoting Pioneer in the European market.

The alliance is seen by both companies as a means to promote each other’s core capabilities and services to established and prospective customers, thus adding further value and access to new geographical markets.

“The tie-up with Pioneer will allow Labtech to access the US space and defence markets and support our ongoing development in these sectors”, said Bob Lowther, Labtech’s Sales and Marketing Director.
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“Pioneer is a leading supplier of space- and defence-qualified flexible and flex-rigid printed circuit boards and, being based in Southern California, is at the heart of the USA space industry”.

Ken Lee, Sales and Marketing Director for Pioneer, adds: “The opportunity to access the European market through Labtech’s established sales channels should prove to be successful”.

“Labtech is Europe’s leading dedicated microwave PCB supplier and the alliance will allow Pioneer to showcase its wide range of flex-rigid printed circuit board capabilities to the European space and defence community”.

TT Electronics Prestwick Circuits is continuing its capital expenditure programme with the purchase of a new electroless line and automatic optical inspection (AOI) machine
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The fully automated, state of the art electroless copper plating line is purpose built with an excellent vibration and solution agitation system that is ideal for small-hole plating. The new equipment complements Prestwick’s recent investment in a new fully automated pal electrolytic pulse plating line.

In addition Prestwick, one of Europe’s largest manufacturers of printed circuit boards, has invested in an Orbotech Vision-3000AP, a top of the range AOI machine with exceptional inspection performance for high volume production.

In particular the high-accuracy detection provides a superior throughput for a broad range of advanced PCB applications, including microvia and assists in yield improvement.

Derek Mansfield, Managing Director, TT Electronics Prestwick Circuits says: “This is a good step forward for us as it enhances the level of technology and complexity we can offer for multilayer manufacture.

The new electroless line represents a significant investment in PCB manufacturing equipment that will greatly enhance Prestwick’s capability for small hole plating”.

“Both these new pieces of equipment will make a major difference to our manufacturing capabilities enabling Prestwick to undertake higher technology products for leading applications”.

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The bridges are mounted to the rear of the backplanes, which are fully compliant with the latest CompactPCI specifications from PICMG, the PCI Manufacturers Group. By rear mounting, the bridges allow full use of all the slots in both the primary CompactPCI bus and the secondary, or bridged, bus.

The (top of the) tallest component on the 32 or 64bit bridges is less than 16mm from the rear of the backplanes, and so allows the use of off-the-shelf rear transition modules.

Power consumption of the bridges is significantly less than 0.5W at 5V or 1W at 3.3V under normal circumstances, and they derive their power from the bridged backplanes.

Fully compliant with PICMG2.0 R3.0 and compatible with earlier specification products the backplanes include VI/O selection (+3.3 or +5V) and user-definable geographic addresses for each slot.

Versions with the H.110 telecom bus are also available, as are H.110 rear palette low-profile bridges Rittal can provide a chart to show which backplanes from the range should be used with which bridges to create systems from nine slots to a maximum 21 slots in a 19in subrack, driven by a single CPU connected to the primary backplane.