Quatech Inc., a manufacturer of data communication products, has released six multiport serial Low Profile PCI boards. These boards are the first to utilize the Low Profile footprint and fully comply with all other aspects of the PCI 2.2 specification.

Low Profile PCI cards have the same signal protocols, electrical interface, and configuration as standard-height PCI boards. This allows designers to create lower profile stand-alone “thin-client” and high-density rack-mount PC chasses as low as 3.350″ while maintaining the ability to use add-in boards. Manufacturers of low profile systems include IBM, Neoware, Wyse, and several white-box companies.

Quatech’s Low Profile PCI boards are built on 32-bit addressing, and can be used in either standard or low profile PCI backplanes. Quatech products adhere to the MD1 board length specification–the smallest form of Low Profile PCI. They are also narrow enough to fit all 2U rack mount systems without using riser cards. Quatech’s serial Low Profile PCI line leverages the company’s extensive PCI expertise to provide the same rich features found in their standard PCI boards, such as four-layer board design for improved signal integrity, shared interrupts, 16-byte FIFOs, and enhanced speeds of up to 921.6 kbps.

Quatech Low Profile PCI boards have many unique features. For example, their automatic RS-422/485 transmitter enable/disable function permits the hardware itself to regulate data flow by only driving lines while actively transmitting — providing increased speed and convenience over the older software controlled method. Quatech boards also use a universal PCI connector compatible with both the 3.3V connector key required by the specification and the 5V connection used by older PC and thin client systems. This means that they can be used with current equipment and will not need to be replaced as systems are upgraded.

With 6U form factor, 8-slot VITA 31.1 backplane provides 2 fabric slots for dual redundant routing of switch fabric across P0 connectors. As P0 connectors in VME64x are undefined, payload slots are fully backwards-compatible. Unit adopts PICMG 2.16 P3 connector pinout for use on VME64x boards and meets VITA 1.7 Increased Current specification. Features include automatic active daisy chain, passive inboard termination, and M3/M4 power bolts for power.

FREMONT, California, May. 16, 2005 - Elma Bustronic Corporation, an industry leading designer and manufacturer of high performance backplanes has teamed up with European sister-company Elma TreNew to develop a new line of VITA 31.1 backplanes. VITA 31 incorporates switched fabrics into legacy VME64x backplanes with backwards compatibility.

The Elma Bustronic 8-slot VITA 31.1 Gigabit Ethernet backplane features two fabric slots for dual redundant routing of the switch fabric across the P0 connectors. As the P0 connectors in VME64x are undefined, the payload slots of the backplane are fully backwards-compatible. VITA 31.1 adopts the PICMG 2.16 P3 connector pinout for use on VME64x boards. It also incorporates the definition of the fabric card described in PICMG 2.16. VITA 31.1 systems and PICMG 2.16-compliant systems can use the same switched fabric boards.

Additional features of the Elma Bustronic 6U VITA 31.1 backplane include an automatic active daisy chain, passive inboard termination, and M3/M4 power bolts for power. The backplane also meets the VITA 1.7 Increased Current specification.

Pricing for the 8-slot VITA 31.1 backplane is under $950.00 depending on volume and configuration requirements. The lead time is 4-6 weeks ARO.

Based on PICMG specification, EXP0 four-slot CompactPCI Express backplane contains system slot, one Type 1 slot, and 2 Type 2 slots. Backplane, featuring 10-layer stripline design and user available backplane I/O of P3, P4, and P5 connectors. CompactPCI Express supports Intel PCI Express architecture in 6U-160 Eurocard form factor. It connects cards via serial point-to-point bus with read-only bandwidth up to 2.5 Gbps or (8x) 2.5 Gbps full duplex bandwidth.

FREMONT, California, Nov. 29, 2005 - Elma Bustronic Corporation, an industry leading designer and manufacturer of high performance backplanes has developed a new 4-slot CompactPCI Express (EXP0) backplane.

Based on the new PICMG (PCI Industrial Computer Manufacturer’s Group) specification, the EXP0 backplane has several key features. The Elma Bustronic design contains a system slot, one Type 1 slot, and two Type 2 slots. The 4-slot backplane has a 10-layer stripline design. The high performance capability of the new CompactPCI architecture makes possible performance levels that will support such features as a new generation of video graphic capability. The backward compatibility to CompactPCI and the wealth of user available backplane I/O of the P3, P4 and P5 connectors will allow many new specialized applications to be supported while continuing to support all existing card designs.

CompactPCI Express supports the next generation Intel PCI Express architecture in the familiar 6U-160 Eurocard form factor. It connects cards via a serial point-to-point bus with a read-only bandwidth of up to (16x) 2.5 Gigabits/second or (8x) 2.5 Gigabits/second full duplex bandwidth. CompactPCI Express provides support for several different card for factors with connectivity in 1x, 2x 4x, and 8x increments. Each link represents one full duplex 2.5 Gigabit/second interconnect path. The support of legacy 32 or 64 bit CompactPCI boards is accomplished by a PCIe-to-PCI bridge. CompactPCI boards of 33MHz, 66MHz, or 133MHz are possible. Because the CompactPCI Express architecture continues to support the P3, P4 and P5 in all 6U slot types, CompactPCI Express can continue to support for all existing CompactPCI secondary architectures such as PICMG 2.5, 2.20, 2.16, 2.17 and 2.18 either as functions on native CompactPCI Express cards or as legacy cards in the original CompactPCI form.

A technology breakthrough has opened a new low-cost and rapid method for manufacturing single prototypes and short runs of both flat and 3D-formed printed circuit boards
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The new technology is based on thermoplastic bodies, manufactured by free forming, such as selective laser sintering (SLS) or fused deposit modelling (FDM). The metal circuits are applied by metal foil hot embossing. The foils can range in thicknesses from 10 to more than 100um. A range of plastics can be used with up to +250C temperature resistance.

Linewidths can be manufactured from 0.2mm and upwards, and the clearance between circuits may be as close as 0.2mm.

The only geometric limitation in 3D is no sharp corners.

The new technology allows new concepts in electronics design.

Instead of using conventional printed circuit boards it is now possible to incorporate electronics in plastics with other functions.

This can save component numbers, weight and cost, increasing reliability and giving designers more freedom.

Invotec Group has won a prestigious award from BAE Systems for its manufacturing site in Tamworth, Staffordshire
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The site is one of the first suppliers to BAE Systems Avionics sector to have achieved the award. As Europe’s largest manufacturer of time-critical, high-technology printed circuit boards, Invotec is honoured to achieve such an accolade from BAE Systems, one of the most respected companies in the UK.

Following a year of strict analysis and quality improvement projects, Invotec was presented with BAE Systems’ Bronze trophy for the Supplychain Excellence Programme in a special ceremony held at Invotec’s Tamworth plant on Friday 24th October 2003.

The Supplychain Excellence Programme has been in operation since the early 1990s and is intended to create partnerships with strategic supply chains to facilitate ongoing joint improvements.

Planning and proactive engagement with the supplier is applied in order to deliver an excellence approach through business and manufacturing assessment.

David Jones, Chief Executive, Invotec said: “BAE Systems in Rochester contacted Invotec about 15 months ago and invited us to join the Supplychain Excellence Programme.

Only ’strategic’ suppliers are invited to join the programme which is basically a scheme where they ‘help us to help ourselves’ and to follow a path of continuous improvement.
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We were absolutely delighted when they informed us that we had achieved the Bronze level of excellence, particularly as we are one of the first suppliers to BAE Systems Avionics to do so”.

Suppliers are selected on their strategic importance to BAE Systems and joint improvement activities are based on the output of the supplier assessment.

Assessments are carried out by a multidisciplinary team, and monitored regularly against a time-based plan.

Performance improvements in quality, delivery and relationship are measured and savings determined against a cost reduction plan.

Achievement by the supplier of performance targets leads to recognition via awards.

Jones continued: “BAE Systems launched the assessment in the summer of 2002, with an intensive three day audit of the management and business systems at Tamworth.

A report was then issued, highlighting the main areas for improvement in manufacturing and business processes.

Invotec devised an improvement plan known internally as ‘Project Endeavour’ which has now been successfully implemented”.

“Project Endeavour involved all 150 employees and ‘took people back to basics’ with rudimentary retraining on quality tools and techniques.

Employees were encouraged to take responsibility for minimising material wastage, and organising their own working areas.

Endeavour has been an outstanding success for Invotec and will be continued in the future”.

Other significant areas of improvement included business communications for both internal and external audiences.

Invotec implemented a programme of both customer and employee questionnaires - this will now take place biannually.

One year on, a second assessment confirmed to BAE Systems that Invotec had reached the Bronze standard of efficiency.

Sue Wood, MD, BAE Systems Avionics Systems commented: “It is a credit to the achievements made by Invotec (Tamworth) that it is to receive the BAE Systems Supplychain Excellence Bronze award.

Invotec is one of the selected ’strategic suppliers’ to BAE Systems invited to join the Supplychain Excellence Programme.

We look forward to continued development of our relationship using the Supplychain Excellence Programme to realise further business benefits to mutual advantage”.

Jones added: “The programme is certainly a challenge and we have found the process both hard work and rewarding, the benefits are multifaceted as it has helped us to examine the internal workings of the Tamworth site through external eyes.

We have implemented changes that will improve efficiency for all our customers and this level of attainment will also be recognised by other organisations”.

“We are looking forward to working towards the Silver, the emphasis will be more on manufacturing and we will need to improve initiatives with our own suppliers - so look out.

We believe that we can realistically achieve it by Autumn 2004 - no company has achieved the Silver award yet and Invotec would like to be the first”.

A strategic marketing alliance has been formed between leading printed circuit board manufacturers in Wales and the USA
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Labtech, based in Presteigne, Mid Wales, is linking up with Pioneer Circuits, of Santa Ana, California, which manufactures rigid, flexible and rigid-flex printed circuit boards. The new alliance, a noncompetitive agreement, allows both companies to promote each other in specific territories by using existing sales channels.

Pioneer will promote Labtech’s core capabilities to the North American space and defence markets and Labtech will reciprocate by promoting Pioneer in the European market.

The alliance is seen by both companies as a means to promote each other’s core capabilities and services to established and prospective customers, thus adding further value and access to new geographical markets.

“The tie-up with Pioneer will allow Labtech to access the US space and defence markets and support our ongoing development in these sectors”, said Bob Lowther, Labtech’s Sales and Marketing Director.
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“Pioneer is a leading supplier of space- and defence-qualified flexible and flex-rigid printed circuit boards and, being based in Southern California, is at the heart of the USA space industry”.

Ken Lee, Sales and Marketing Director for Pioneer, adds: “The opportunity to access the European market through Labtech’s established sales channels should prove to be successful”.

“Labtech is Europe’s leading dedicated microwave PCB supplier and the alliance will allow Pioneer to showcase its wide range of flex-rigid printed circuit board capabilities to the European space and defence community”.

TT Electronics Prestwick Circuits is continuing its capital expenditure programme with the purchase of a new electroless line and automatic optical inspection (AOI) machine
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The fully automated, state of the art electroless copper plating line is purpose built with an excellent vibration and solution agitation system that is ideal for small-hole plating. The new equipment complements Prestwick’s recent investment in a new fully automated pal electrolytic pulse plating line.

In addition Prestwick, one of Europe’s largest manufacturers of printed circuit boards, has invested in an Orbotech Vision-3000AP, a top of the range AOI machine with exceptional inspection performance for high volume production.

In particular the high-accuracy detection provides a superior throughput for a broad range of advanced PCB applications, including microvia and assists in yield improvement.

Derek Mansfield, Managing Director, TT Electronics Prestwick Circuits says: “This is a good step forward for us as it enhances the level of technology and complexity we can offer for multilayer manufacture.

The new electroless line represents a significant investment in PCB manufacturing equipment that will greatly enhance Prestwick’s capability for small hole plating”.

“Both these new pieces of equipment will make a major difference to our manufacturing capabilities enabling Prestwick to undertake higher technology products for leading applications”.

A new range of modular CompactPCI backplanes is available with two to eight slots, which enable the bus to be extended via ultra-low-profile bridges
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The bridges are mounted to the rear of the backplanes, which are fully compliant with the latest CompactPCI specifications from PICMG, the PCI Manufacturers Group. By rear mounting, the bridges allow full use of all the slots in both the primary CompactPCI bus and the secondary, or bridged, bus.

The (top of the) tallest component on the 32 or 64bit bridges is less than 16mm from the rear of the backplanes, and so allows the use of off-the-shelf rear transition modules.

Power consumption of the bridges is significantly less than 0.5W at 5V or 1W at 3.3V under normal circumstances, and they derive their power from the bridged backplanes.

Fully compliant with PICMG2.0 R3.0 and compatible with earlier specification products the backplanes include VI/O selection (+3.3 or +5V) and user-definable geographic addresses for each slot.

Versions with the H.110 telecom bus are also available, as are H.110 rear palette low-profile bridges Rittal can provide a chart to show which backplanes from the range should be used with which bridges to create systems from nine slots to a maximum 21 slots in a 19in subrack, driven by a single CPU connected to the primary backplane.

PCB Quotes runs a Web site providing access to quotations from PCB manufacturers. It has introduced a payment scheme toto reimburse users for their time spent in accessing the system.
PCB Quotes, the company that runs a Web site providing swift and direct access to quotations from PCB manufacturers, has introduced a payment scheme to reimburse users for their time spent in accessing the system. For every enquiry registered on its web site, PCB Quotes will credit £5 to the user’s account. Once a user registers ten qualified enquiries within a twelve-month period, a cheque for £50 will be sent to the company or to a charity of its choice.

If the user does not register ten enquiries in the required period the amount due will automatically be paid to charity.

John Bradford, managing director of PCB Quotes explained the reason for this initiative saying: “We have always claimed that this service is free.

In fact, there are costs involved in terms of time and call charges and we now intend to reimburse our users.

We expect a very enthusiastic response from the many buyers that have used PCB Quotes since the site opened in November.”

PCB Quotes is a unique service in that it only sources quotations from UK PCB manufacturers and the company takes no commission on sales but earns its income from an annual subscription from subscribing manufacturers.

APW Electronic Solutions has developed a 15-slot CompactPCI EtherPlane backplane (EPB) for Performance Technologies, the leading US system developer and integrator.
Continuing its long-established tradition of supporting emerging technologies with early prototypes, APW Electronic Solutions has developed a 15-slot CompactPCI EtherPlane backplane (EPB) for Performance Technologies, the leading US system developer and integrator. The EPB extends the CompactPCI specification with a packet-based (Ethernet) switching architecture to create an embedded system area network (ESAN), integrating a scaleable LAN into the embedded systems environment with inherent hot swap and HA capability. EPB will reduce time to market through increased integration at the network/transport layers, enabling embedded system integrators to combine the power of IP with the ubiquity of Ethernet and the bandwidth of fibre.

The EPB supports scaleable bit rates of 10, 100 or 1000Mbit/s per slot, giving the choice between low cost or high performance; hot swap is provided through the standard CompactPCI specification and high availability is enabled through redundant Ethernet switching.

EPB uses only 20 pins in the J3 area per slot, it is non invasive to J1, J2, J4 and J5.

The EPB provides a CAT5 equivalent connection for every slot.

Integrating Ethernet with CompactPCI has enormous potential; the inaugural meeting of a PICMG 2.16 subcommittee was held on 9th November 2000 to consider introducing a new subset, provisionally entitled packet switching Backplane, to the PICMG CompactPCI specification.