IBM ‘SMIFs’ a fab for cleanliness - Asyst Technologies Inc.’s microenvironment clean room process
Categories: Cleanroom EquipmentBelmont, Calif.–Speaking at a seminar on manufacturing competitiveness, IBM senior engineering manager Boris Lipkin revealed that IBM has outfitted an entire 200-millimeter wafer fabrication line with standard mechanical interface (SMIF) “microenvironments” and logistics control systems from Asyst Technologies Inc.
Dr. Lipkin said IBM implemented the cleanliness approach, which involves transporting wafers in sealed, ultraclean enclosures, after it found that Asyst’s microenvironment products met or exceeded all of the company’s requirements for contamination control. He would not disclose the location of the line.
“Our requirements were for lower defect densities, lower particle contamination, containment of cleanroom costs, reduction of handler-based manufacturing errors and reduction of processing errors,” said Dr. Lipkin.
He added, however, that while IBM has seen some yield improvement as a result of the implementation, it will be a while before that improvement is quantified in a meaningful way. He also said the company has yet to determine the cost-effectiveness of the system.
Dr. Lipkin said installation of the SMIF line was completed in April.
The magnitude of the project was considerable, said Dr. Lipkin, noting that 43 semiconductor equipment vendors representing 50 tool types and more than 136 individual machines had to be integrated into the microenvironment. Dr. Lipkin said 94 SMIF Arms from Asyst were installed in the front end and another 91 in the back end of the production line.
Logistics control was provided through Asyst’s Smart Tags product line, which include automatic logon/logoff, cassette maps and data histories for improved identification and tracking of cassettes. Other Asyst products integrated into the line included SMIF Pods, sorter/cassette buffers, wafer backside bar code readers and an overhead monorail system.
Dr. Lipkin said suppliers of process tools were asked to integrate their products into the SMIF microenvironment.
“Some of them took a more serious approach, some less,” he said, noting that the difference was fairly obvious once the line was fully implemented. Suppliers to the line included Silicon Valley Group, ASM Lithography and Varian Associates, he said.
In general, the line appears to be functioning far below specified requirements, Dr. Lipkin said, adding that early yields analyses are “not conclusive, but they are promising.”
Dr. Lipkin said particle counts in the first several weeks were naturally higher due to contamination introduced in the installation of the line. After that time, particle counts generally dropped well below the specification.
Several concerns arose from the project, he said, including pod outgassing and cleaning and arm reliability. Those problems are being addressed, he said.
James Harper, director of strategic integration at Sematech, said Sematech has modeled the SMIF microenvironment in fab settings and determined that “a large factory (30,000 wafer starts per month) producing 0.25 micron product can realize a 2 percent cost reduction using minienvironments.”
“That translates to an annual savings of $15 million to $20 million, or about $50 per wafer,” he said.
Still, he said, it’s just a step along the way to where device manufacturers really want to be. “It’s on the evolutionary path, it’s an important step in the road. Microenvironments represents a step in separating the wafer from the environment. The bad news is, from here on, it becomes an even bigger challenge. The wafer has to be isolated all the time, not just part of the time.”
Dr. Harper said one of the more frustrating aspects of conntamination control is “an extremely long cycle time between the time an idea comes out and the time it is used in production manufacturing.”
For example, he said, Asyst’s SMIF product line has been available since 1987, but companies such as IBM are just now beginning to implement the microenvironment concept in a production line.