MAX[R] II EPM240, EPM570, and EPM1270 are available in 100- and 256-pin, 0.5 mm Micro FineLine BGA[R] (MBGA) packages or 100-pin, 1.0 mm FineLine BGA (FBGA) package to meet form-factor and power capabilities needed by portable systems. MBGA packages suit applications requiring high I/O count per board area to interface with LCD displays, keypads, flash, or memory. Along with power-down capability, features include high logic density, on-chip voltage regulator, and internal oscillator.

New Ultra-Small Packages Offer 50 Percent Lower Cost and 50 Percent Lower Power Than Competing Devices

San Jose, Calif., July 10, 2006-Altera Corporation (NASDAQ:ALTR) today announced it has expanded the MAX[R] II device family to address the growing portable applications market. With new ultra-small packages, a new power-down capability and the lowest cost in the industry, MAX II devices offer designers of handheld applications half the cost and power of competing products. Altera[R] MAX II CPLDs meet the small form-factor package and low power capabilities needed by designers of portable systems such as point-to-multipoint (PMP) systems, barcode scanners, PDAs and handheld sensors.

“After evaluating a number of component solutions, we determined that MAX II devices were the best fit for our Multiple Integrated Laser Engagement Systems (MILES)-compatible battery-powered wireless laser sensor,” said Mark Chaildin, systems engineer at Intercoastal Electronics. “MAX II devices’ low power consumption, short power-up times, density offerings and low cost help us stay competitive in the marketplace.”

According to the Gartner Dataquest report entitled “Semiconductor Forecast Worldwide-Forecast Database” by Nolan Reilly and Richard Gordon (May 2006), portable applications use in the consumer market is expected to grow from an estimated $16B in 2006 to $19B by 2008, a CAGR of 9 percent. The new MAX II ultra-small packages and power-down capabilities are targeted at this market and are expected to accelerate the adoption of MAX II devices into portable applications.

Higher Levels of Integration at Lower Cost and Power

The MAX II EPM240, EPM570 and EPM1270 devices are now available in 100-pin and 256-pin 0.5-mm Micro FineLine BGA[R] (MBGA) packages and 100-pin 1.0‑mm FineLine BGA (FBGA) package. Using the new MBGA packages, designers can integrate 50 percent more user I/O and logic elements (LEs) for a given board area, on average, than competing CPLD solutions. This makes MAX II CPLDs ideal for applications requiring high I/O count per board area (mm2) to interface with LCD displays, keypads, flash or memory. Designers can further reduce system cost by using the new packages and MAX II devices’ differentiating features, including high logic density, an on-chip voltage regulator and an internal oscillator, to integrate discrete devices and minimize the number of power rails.

MAX II CPLDs also offer the lowest dynamic power-more than 50 percent lower than competing CPLD solutions-and a power-down capability that conserves battery life. Unlike competing CPLDs, the power characteristics of MAX II devices enable them to power down to eliminate current draw entirely. To learn more about power savings using MAX II CPLDs, visit www.altera.com/max2-lowpower and www.altera.com/support/examples/max/exm-power-down.html.

“Designers of portable or battery-powered applications face many of the same challenges that have fueled the programmable industry for the last twenty years, namely shortened schedules, feature uncertainty caused by changing industry standards and cost pressures. With a zero-power mode and package sizes common to this market, portable designers can now benefit from using CPLDs from Altera,” said Luanne Schirrmeister, Altera’s director of low-cost product marketing.

Read more about the new MAX II enhancements in the “Reduce Total System Cost in Portable Applications Using MAX II CPLDs” white paper, at www.altera.com/literature/wp/wp-01001.pdf. To learn more about MAX II CPLDs, visit www.altera.com/max2.

Analog Devices unveiled a major breakthrough in radio frequency (RF) detection for wireless infrastructure equipment. Analog Devices has developed the industry’s first logarithmic RF detector to accurately measure the power of radio signals from 1MHz to 8GHz, exceeding the previous maximum of 2.5GHz. Accurate RF power measurement can reduce the size and cost of expensive RF power transmitters, and is a key to easing wireless network management challenges. Maintaining the detector dynamic range up to 8GHz has never before been possible.

The AD8318, a monolithic semiconductor-based detector, is superior to traditional alternatives because it is more cost-effective than module solutions and more accurate than discrete diode-based detectors. Its unique combination of accuracy and broad dynamic range allows the device to be used in many types of wireless communications infrastructure equipment, including GSM, CDMA, and W-CDMA cellular base stations (which operate up to 2GHz), W-LAN 802.11 applications (which require 5GHz), and point-to-point fixed wireless systems (which operate up to 30GHz).

Analog Devices, Inc. Tuesday announced at Wireless Symposium/Portable by Design a new radio frequency (RF) detector/controller that enables precise, temperature-stable power amplifier control and supports all current and emerging cellular standards. The AD8314 replaces discrete diode detectors and offers wireless designers a single- package, temperature-stable IC solution.

Operating at up to a 2500 MHz operating frequency with 45 dB dynamic range, the AD8314 handles a wide signal range, enabling it to support all current and emerging cellular and PCS standards. Because the AD8314 provides precise, temperature-stable power amplifier control with 0.5 dB accuracy, designers no longer have to adjust for temperature variability during manufacturing, and design time is reduced. The AD8314 also minimizes board area due to 8-pin microSOIC packaging, which reduces required real estate by as much as 50%. With its superior functionality and performance, the AD8314 is an efficient solution for the measurement and control problems that plague RF transmitter designers.

“The AD8314 measures and controls power amplifiers with minimal temperature drift, replacing highly varying discrete diode detectors,” said John Greichen, RF/IF marketing manager, Analog Processing Products, Analog Devices. “Its 0.5 dB accuracy represents a new level of performance up to 2.5 GHz, enabling an RF engineer to design a high performance transmitter. With the AD8314, Analog Devices extends its proprietary portfolio of logarithmic amplifiers for RF/IF measurement and control applications, building off the highly successful AD8313 RF Detector architecture.”

Two new 30V MOSFET synchronous buck convertor chipsets suit notebook computer designs where small size, high efficiency and improved thermal conduction are required.
International Rectifier has introduced two new 30V DirectFET MOSFET synchronous buck convertor chipsets for advanced notebook computer designs using the latest Intel and AMD processors where small size, high efficiency and improved thermal conduction are required. The new 30V chipsets offer high efficiency over their entire rated load range. In addition, these 30V devices offer higher power density than traditional packaging options through the smaller package size and the ability to operate at high current levels using a single control and a single sync MOSFET.

This means improved thermal performance and smaller form factors, necessary for super-compact, battery-efficient, portable and mobile computing.

Each chipset consists of a control MOSFET and a synchronous MOSFET, with each device tailored to maximise performance in their role within a synchronous DC/DC buck convertor circuit.

Control MOSFETs have reduced switching losses, whereas synchronous MOSFETs have low conduction losses (low on-resistance), and low reverse-recovery charge.

The first chipset, the IRF6617 control FET and IRF6611 synchronous FET, is designed for optimum performance up to 20A per power channel in high density, space-restricted circuit boards.

The second pair, the IRF6637 control FET and IRF6678 synchronous FET, is designed for increased thermal performance in applications requiring greater than 20A per power channel.

The IRF6617 control FET is housed in a small can (ST) DirectFET package whereas the IRF6637 control FET housed in the medium can (MP) DirectFET package.

To enable an easy migration path for existing designs, both synchronous FETs are housed in the medium can (MX) DirectFET package, allowing a simple change from the IRF6611 to the IRF6678 when more current or increased thermal performance is desired.

The new chipsets also enable circuit designers to shrink high frequency, high current DC/DC convertors used to power high-end desktop computers and servers, as well as advanced telecom and datacom systems.

International Rectifier’s patented DirectFET MOSFET packages present a whole new set of design advantages not previously delivered by standard plastic discrete packages.

Their metal can construction enables dual-side cooling that effectively doubles the current handling capacity of high frequency DC/DC buck convertors powering advanced microprocessors.

In addition, devices in the DirectFET packages are lead- and bromide-free.

Credowan is the newly appointed exclusive UK representative and stockist for CTM pin diode products formally known as Temex.
Credowan is the newly appointed exclusive UK representative and stockist for CTM pin diode products formally known as Temex.

The range of products includes: silicon PIN diodes (switching, attenuating, limiting, low cost surface mount, surface mount nonmagnetic, high voltage, phase shifting, two- and three-port switch modules); tuning varactor diodes (high Q); and step recovery diodes and multiplier varactors.

A new synchronous buck convertor chipset is suitable for high-frequency high-current DC/DC convertors used in advanced telecomms and datacomms systems.
International Rectifier has introduced a new DirectFET MOSFET synchronous buck convertor chipset which is suitable for high frequency, high current DC/DC convertors used in advanced telecomms and datacomms systems and next generation Intel and AMD processors found in high-end desktops and servers. For example, in 130A five-phase convertors, the IRF6619 and IRF6633 chipset delivers 85% efficiency in a compact footprint. The new IRF6619 and IRF6633 chipset replaces four standard D-Pak MOSFETs per phase in processor power systems, cutting component count in half and reducing MOSFET board space by over 50% per phase, enabling a smaller form factor for workstations and servers.

An ideal synchronous MOSFET, the IRF6619 features a very low typical device on-resistance of 1.65mohm at 10V GS and 2.2mohm at 4.5V GS, with a low reverse recovery charge of 22nC.

The IRF6619 is housed in the MX medium can DirectFET package, occupying the same board area as an SO-8, but with a 0.7mm profile.

The IRF6633 is best-suited as a control FET, with very low gate charge and Miller charge of only 4nC, and has more than 43% reduction in on-resistance times gate charge compared with other 20VN devices on the market.

The IRF6633 performance figure-of-merit for combined on-state resistance and gate charge is 38mohm-nC.

The IRF6633 is housed in the MP medium can DirectFET package, occupying the same board area as SO-8 with only 0.7mm profile.

International Rectifier’s patented DirectFET MOSFET packages present a whole new set of design advantages not previously delivered by standard plastic discrete packages.

Their metal can construction enables dual-side cooling that effectively doubles the current handling capacity of high frequency DC/DC buck convertors powering advanced microprocessors.

Extending its expertise in power management solutions, Solid State Supplies has been appointed UK distributor for Ixys.
Extending its expertise in power management solutions, Solid State Supplies has been appointed UK distributor for Ixys. ‘Ixys with Westcode and the inclusion of Clare, has that feel of IR all over again’, said Alan Hebdon, Ixys Franchise Manager at Solid State Supplies and IR’s Distribution Manager for ten years before joining the Kent company. ‘But with it comes some great RF products that seem to have been a well kept secret until now’, he added.

Among the new products being offered from their latest franchise, Solid State Supplies will be able to supply MOSFETs, FREDs, IGBTs and RF drivers for up to 45MHz from Ixys, diodes, thyristors and GTOs from Westcode, SSRs from market leader CP Clare and hybrid microwave amplifier modules for industrial, military and space applications up to 20GHz from MicroWave Technology.

As well as seeing an increase in the UK waveguide market, Credowan has recently been appointed the exclusive UK representative and stockist for CTM PIN diode products.
As well as seeing an increase in the UK waveguide market, Credowan has recently been appointed the exclusive UK representative and stockist for CTM PIN diode products. Lorraine Cody has been appointed to the new position of Product Manager. Cody has an extensive knowledge of the PIN-diode industry and will be a great asset to the team.

Dean Terrett has been appointed as Field Sales Engineer.

As well as maintaining and growing existing accounts, he will be developing new opportunities.

Terrett has a very strong microwave background and has previously worked in R and D for a leading solid-state high power microwave amplifier manufacture.

Rohm Electronics is significantly enlarging its ultracompact power-MOSFET lineup, which already encompasses 60 different devices.
Rohm Electronics is significantly enlarging its ultracompact power-MOSFET lineup, which already encompasses 60 different devices. Besides simple N- and P-channel MOSFETs, pairs of transistors or combinations with Schottky diodes can be specified to save PCB area and costs. The different packages offer 3, 5 or 6 pins, depending on the version.

The MOSFETs are available in drain-source voltages of 20 or 30V, and in drive voltages of 2.5 and 4V.

The footprints of the TUMT and TSMT packages are just 2.0 x 2.1 and 2.8 x 2.9mm, with respective heights of 0.85 and 1mm for TSMT.

Despite these very small sizes, the MOSFETs are able to switch currents up to 4.5A, depending on the specific version.

These high current values are made possible by special mounting and packaging techniques in addition to extremely low channel resistances.

Some devices offer values as low as 30mohm (for a gate-source voltage of 4.5V).

The maximum power dissipation of Rohm’s TUMT and TSMT MOSFETs range from 0.8 to 1.2W.

This is an improvement of up to 330% compared with other packages with the same footprint size.

A new family of 100 to 600V standard and HiPerFET power MOSFETs incorporate a proprietary cell design that reduces on-resistance by 30%, enabling improved efficiency.
Ixys Corp has a new family of 100 to 600V standard and HiPerFET power MOSFETs based on its new technology PolarHT and PolarHV platforms incorporating a proprietary cell design that reduces on-resistance by 30%, enabling improved efficiency. These new families of power MOSFETs continue Ixys’ leadership position in the high power, high voltage power conversion market. Ixys’ proven HiPerFET process yields power MOSFETs with a fast intrinsic body diode for low Qrr and enhanced dV/dt ruggedness.

Ixys’ HiPerFETs are targeted at hard switching inverter and power supply applications.

These products are currently finding significant use in demanding IT and telecomms switch-mode power supplies that require efficient switching and energy conversion in tight enclosures, as well as applications where high reliability is critical.

The PolarHT line is available to support applications requiring voltage ratings from 100 to 300V, ranging across a broad spectrum of consumer, industrial and automotive markets.

Examples include telecomms switch mode power supplies and motor drives for the industrial market, plasma display and audio amplifiers for consumer applications and ignition systems and electric vehicles for the automotive market.

These devices bridge the gap between high voltage technology and low voltage Trench MOSFETs.

They provide significantly more ruggedness and safe operating area then trench power MOSFETs.

PolarHV starts at 500 and 600V, with extension to higher voltages planned.

Ixys offers one of the broadest ranges of current ratings, with product extending from 1 to 80A and above.

This higher voltage product line brings the same benefits of enhanced performance and cost-effectiveness to core market requirements in the middle voltage ranges.

Example applications are offline switch-mode power supplies of all sizes and applications, from small wall socket style supplies to applications ranging to rack mount power systems.

Products will be offered in various standard packages, including the full spectrum of surface mount and discrete packages (D-Pak to TO-268, TO-220 to the SOT-227).

In addition, versions will be offered in Ixys proprietary Isoplus packages providing UL approved 2500V isolation with superior thermal cycling and thermal performance, ISOPLUS220 and ISOPLUS247.