Spansion’s Flash memory devices are in the process of being validated for select reference design platforms from Qualcomm.
Spansion’s Flash memory devices are in the process of being validated for select reference design platforms from Qualcomm. Spansion expects validation efforts of MirrorBit NOR and ORNAND memory devices to be completed in the second quarter of 2006. Following verification that the products are compatible, Spansion’s solution will enable handset manufacturers to get phones to market faster, with the latest feature-rich multimedia capabilities that are designed to meet operator requirements for the complete range of phones.

‘Simplifying the design process for device manufacturers reduces time to market for new handsets’, said Luis Pineda, Senior Vice President of Marketing and Product Management at Qualcomm CDMA Technologies.

‘Products such as MirrorBit ORNAND and NOR provide the data-storage capacity and performance capabilities required to support in-demand, next-generation mobile experiences’.

The selection of Flash memory is becoming a strategic decision that impacts the ability for the handset OEM to create differentiated phones to meet the growing demand for data, as well as to enable flexibility to address the full range of phone segments.

Handset designers typically undertake the costly and time-consuming process of testing and validating memory products during the phone design process.

‘By collaborating with Qualcomm, a leader in the wireless industry, Spansion can offer compatible memory solutions that help streamline the development process for handset designers’, said Amir Mashkoori, Executive Vice President, Wireless Solutions Division, Spansion.

‘This allows OEMs to address the growing demands of advanced multimedia features in mainstream handsets and focus on creating innovative phones that can be brought to market in significantly less time’.

MirrorBit NOR memory solutions are currently undergoing validation for select chipsets from Qualcomm’s Value Platform, targeted primarily for cost-sensitive markets.

MirrorBit ORNAND memory and software solutions are in the process of undergoing validation for future use with select Qualcomm high-performance Mobile Station Modem chipsets to enable higher datarates for advanced multimedia and convergent phones.

Spansion’s MirrorBit NOR and ORNAND memory solutions deliver high-performance code execution and data storage with a single-platform approach.

The scalable design allows for basic entry-level phones using only NOR devices, up to very-high-end fully featured phones that combine NOR and ORNAND devices, to address a wide range of applications and market segments.

The mModule CF 5000 is an industrial grade CompactFlash range that will be available in a variety of capacities ranging from 32Mbyte to 8Gbyte.
The mModule CF 5000 is an industrial grade CompactFlash solution that will be available in a variety of capacities ranging from 32Mbyte to 8Gbyte. The addition of industrial grade CompactFlash to M-Systems’ product line enables the company to offer its customers a comprehensive set of solutions for the embedded market that also includes mSSD (formerly FFD), mDOC and the mModule uDOC and iDOC. Known for developing high performance memory solutions, M-Systems, through the mModule CF 5000, will also offer customers an unbeatable combination of outstanding reliability, security and an extended lifespan for an overall smarter solution.

This is particularly important for mission-critical applications such as routers, PBXs, wearable computers, industrial PCs and point of sale (POS) equipment.

‘Based on customer feedback and recent changes in the market, we see that the demand for industrial grade CompactFlash is quite strong’.

‘We believe that mModule CF 5000 provides the most rugged and reliable data storage solution for mission critical applications’, said Noam Kedem, M-Systems’ Vice President of Marketing.

‘We see this product introduction as building on our commitment to offer our customers a comprehensive range of solutions’.

‘mModule products, such as the CF 5000, deliver rugged and reliable memory solutions, made smarter’.

With a central focus on developing smarter storage solutions, the mModule CF 5000 exemplifies a number of M-Systems’ key attributes M-Systems’ Ultra DMA 5 technology transfers data at a rate of 20Mbyte/s, and includes performance boosters such as multiplane access and on-the-fly error detection.

M-Systems’ patented TrueFFS technology in firmware brings top data integrity to mModule CF 5000, even during power loss.

M-Systems’ patented TrueFFS management solution applies dynamic bad block management, and error detection and correction code (EDC/ECC) to maximise data reliability.

mModule CF 5000 performs dynamic and static wear-leveling to distribute data evenly over the flash media, thereby extending the flash lifespan up to 5 million write/erase cycles per block.

The mModule CF 5000 core implements sophisticated encryption algorithms, including 256bit AES, sanitising (purge), and quick erase for superior security.

The mModule CF 5000 can withstand severe weather conditions, shock, high altitude and rigorous vibrations.

The mModule CF 5000 complies fully with MIL-STD-810F, meeting the strictest reliability requirements for mission-critical applications.

Kingston Technology’s FB-DIMM modules are a high-speed high-density memory solution for related technology workstation and server platforms.
Kingston Technology has released a new line of fully buffered dual-inline memory modules (FB-DIMMs). As the world’s largest independent memory manufacturer, Kingston Technology took an early decision to support FB-DIMM, committing major resources to the research and development of this next generation technology. This bold strategic decision is now paying-off, with Kingston Technology fast becoming the leading manufacturer and supplier of FB-DIMM memory to Intel and the industry.

Kingston Technology’s FB-DIMM modules are a high-speed high-density memory solution for related technology workstation and server platforms.

The new modules will offer memory flexibility and greater expansion options, opening new horizons in memory technology.

Kingston’s FB-DIMMs will resolve the DDR2 memory ’speed/capacity’ bottleneck issue and also comply with JEDEC standards.

FB-DIMM memory architecture provides up to six memory channels, with each channel supporting up to eight dual-rank memory modules, enabling two channels to simultaneously read and write in concurrent transactions.

Already a strategic supplier of FB-DIMMs to major OEMs, Kingston Technology’s FB-DIMMs provide a comprehensive solution to many signal integrity and quality concerns.

JK Tsai, Director of Technology at Kingston Technology comments: ‘FB-DIMM architecture increases server memory capacity from 8 to 192Gbyte at a high speed, based on a 4Gbyte-module configuration - delivering an impressive 24-fold increase’.

Tsai continues: ‘In addition to higher capacity, the FB-DIMMs have a peak bandwidth four times greater than standard DDR2 server modules’.

The benefits of using Kingston’s FB-DIMM technology on high-end servers include scalability, flexibility and higher capacity, and the same new technology will increase speed and performance.

Kingston Technology’s engineers have developed special boards and test programs that are used to conduct parametric and characterisation testing on high-end Agilent testers to ensure that FB-DIMMs are functional and comply with industry specifications.

Kingston’s FB-DIMMs come with a lifetime warranty and 24/7 technical support.

Intel Corporation is the first to sample NOR multilevel cell Flash memory chips at 1Gbit density using its advanced 65nm process technology.
Intel Corporation is the first to sample NOR multilevel cell Flash memory chips at 1Gbit density using its advanced 65nm process technology. Intel’s NOR Flash memory chips are used in devices such as cellphones to manage critical phone operations, handle personal information management data and to store photos, music and videos. Intel’s handset OEM customers will benefit from a common Flash architecture that will simplify the migration from 90 to 65nm process technology.

‘With these offerings, Intel continues to lead in providing the industry’s most advanced NOR Flash memory for the mainstream handset market segment’, said Brian Harrison, Intel Vice President and General Manager of the Flash Memory Group.

‘Our 65nm process technology will improve Flash performance to enable the next generation of handsets that deliver new and enhanced capabilities for end users’.

Samples will be available to customers late in the second quarter.

The mDOC H-series embedded Flash drive is now being offered as a NAND Flash-based storage and boot solution for portable terminals based on the OMAP5912 processor.
The mDOC H-series embedded Flash drive (EFD) is now being offered as a NAND Flash-based storage and boot solution for portable terminals based on the OMAP5912 processor from Texas Instruments (TI). M-Systems’ mDOC H-series EFD provides device designers with an easy-to-integrate storage and boot solution using the latest high-density NAND Flash media, including cost-effective multi-level cell (MLC) NAND. Providing high reliability and multimedia performance levels delivered through M-Systems’ Flash management technologies, such as the patented TrueFFS Flash file system, mDOC H-series is well suited to meet the growing demand for high density smart storage in portable terminals and other OMAP5912-based applications.

OMAP5912 is a highly integrated hardware and software platform, designed to meet the application processing needs of next-generation embedded devices.

The OMAP platform enables device designers to quickly bring to market devices featuring rich user interfaces, high processing performance, and long battery life through the maximum flexibility of a fully integrated mixed processor solution.

The dual-core architecture provides benefits of both DSP and reduced instruction set computer (RISC) technologies, incorporating a TMS320C55x DSP core and a high-performance ARM926EJ-S ARM core.

‘M-Systems’ mDOC H-series, with its standardised NOR-like interface, allows all of our customers to reap the rewards of cost-effective NAND Flash without traditional design and integration tradeoffs’, said Huy Pham, OMAP Marketing Manager, TI.

‘Embedded applications can efficiently tap into the latest raw NAND material with the mDOC H-series’ standard EFD interface without risking their increasingly demanding project schedules’.

‘It will help our customers focus their efforts on making superior products, faster’.

‘We are proud of our continuing collaboration with TI and are pleased to once again see the M-DOC EFD selected as the boot and high-density storage solution of choice for OMAP-based designs’, said Noam Kedem, Vice President of Marketing for M-Systems.

‘Much like the OMAP5912’s architecture, our DiskOnChip architecture offers designers ease of integration and cost savings, thanks to the marriage of raw SLC or MLC NAND material and our Flash management technologies’.

‘mDOC H-series is embedded Flash storage made smarter’.

The MSC8144 provides an optimal DSP solution for wireline infrastructure applications, such as carrier-class trunking, enterprise VoIP media gateways and video conferencing servers.
Freescale Semiconductor has introduced its third-generation multicore DSP based on next-generation SC3400 StarCore technology. The new MSC8144 DSP is engineered to deliver leading-edge performance, reduce system costs and significantly increase channel densities for next-generation wireline and wireless infrastructure applications providing voice, video and data services. The MSC8144 provides an optimal DSP solution for wireline infrastructure applications, such as carrier-class trunking, enterprise VoIP media gateways and video conferencing servers.

Wireless applications served by the MSC8144 include wireless voice transcoding and IP multimedia subsystem (IMS) gateways, video multi-point conferencing units, baseband cards for 3G, Super 3G and WiMax basestations, and Layer 2 processing in radio network controllers (RNCs).

‘A prime example of network convergence is ‘access anywhere’ communications, enabled by IMS gateways’, said Lynelle McKay, vice president and general manager of Freescale’s Digital Systems Division.

‘The ability to adapt media sessions as users change locations and even devices while maintaining exceptional QoS for triple-play services is invaluable’.

‘The MSC8144 multicore DSP provides the processing performance and flexibility needed to deliver these converged network capabilities within a low power envelope’.

The new MSC8144 takes single-chip DSP integration to a new level of sophistication.

Combining four StarCore DSP cores at up to 1GHz each, the MSC8144 delivers the industry’s highest gigahertz performance, equivalent to a 4GHz single-core DSP.

It integrates the industry’s largest embedded memory at 10.5Mbytes in a single package, virtually eliminating the need to attach external memories while maintaining a highly competitive cost and power per channel.

‘Freescale’s MSC8144 aims at reaching optimal programmable DSP performance density with attention to low power per channel and low cost per channel’, said Max Baron, Senior Editor and Principal Analyst, In-Stat.

‘These factors are becoming part of the silicon selection process for many large OEM’s in these markets’.

The enhanced, deeper pipeline SC3400 DSP core on which the MSC8144 DSP is based enables higher clock rates and adds new Single Instruction Multiple Data (SIMD) instructions, precise exception and branch prediction.

The SC3400 core also supports improved specialised instructions for Viterbi and video algorithms that virtually double the performance of previous-generation StarCore DSPs.

Each core is surrounded by a highly efficient 16Kbyte instruction cache, 32Kbyte data cache and an MMU (memory management unit) for memory and task protection, enabling development of highly robust software.

‘We are very pleased that Freescale has selected the StarCore SC3400 architecture as the architecture of choice for their next-generation video and digital communications platforms’, said Craig Trautman, Sr Director of Sales and Marketing, StarCore.

‘Freescale’s multicore SC3400 implementation with the MSC8144 will pave the way for more effective multimedia and modem processing in next-generation systems’.

As the advanced SC3400 instructions are a superset of the current SC140 instructions, MSC8144 software is fully binary and assembly-code compatible with Freescale’s existing portfolio of multi- and single-core DSPs based on StarCore technology.

This compatibility enables customers to leverage their software investment.

The MSC8144 DSP’s rich set of peripherals supports a very high I/O bandwidth, which is important to meeting current and future customer needs: dual gigabit Ethernet interfaces support SGMII and RGMII, and a 16bit Utopia interface provides ATM support; a dual-RISC core implementation of QUICC Engine technology enhances overall system performance by offloading performance-consuming communication tasks from the DSP cores; a 4X/1X Serial RapidIO interface delivers high throughput and robust packet transfer; 2048 TDM DS-0 channels handle connectivity to the PSTN networks; 10.5Mbyte internal memory offers the industry’s largest embedded memory; an advanced DDR-I/II controller provides an interface to high-speed, industry-standard memories; and a 66MHz, 32bit PCI bus interface provides additional high-speed connectivity.

‘Freescale’s integration of Serial RapidIO technology on the MSC8144 further validates the need for open, high-speed interfaces for the high level of connectivity needed in next-generation communications equipment’, said Tom Cox, Executive Director of the RapidIO Trade Association.

‘The introduction of the MSC8144 exemplifies how Freescale continues to proliferate RapidIO technology throughout its processor portfolios’.

The highly optimised, yet fully programmable architecture of the MSC8144 DSP provides unmatched densities for voice and video transcoding/transrating and data applications integrated in a full framework.

Meeting the industry need for consolidation and reuse, the MSC8144’s versatility is underscored by its programmability, scalability and abundance of networking interfaces.

This versatility allows OEMs to adapt to changing standards while using the same device, hardware platform and tools for multiple applications.

The MSC8144 also enables OEMs to implement different software loads, resulting in significant savings on development and design of future-proof products.

Freescale offers a full set of development tools and enablement software for the MSC8144 platform solution.

The CodeWarrior integrated development environment (IDE) from Freescale is a highly comprehensive, widely used IDE that includes advanced optimising C/C++ compilers, profiling tools, cycle and instruction accurate simulators, device drivers and operating systems.

The tool set comes with a fully equipped hardware development platform and reference board design.

The OSEck RTOS from Enea also supports the MSC8144, providing a fully pre-emptive, full-featured, compact real-time kernel optimised to provide the high performance and small memory footprint tuned to meet the specific requirements of DSP systems.

Because the MSC8144 DSP core is code-compatible with previous generations of Freescale’s DSPs based on StarCore technology, existing customers can start development immediately.

To help simplify development and speed time to market, OEMs can license optimised multimedia codecs and software frameworks from Freescale and from Freescale’s third-party ecosystem partners.

Based on Freescale’s advanced 90nm silicon-on-insulator technology, the MSC8144 DSP is planned to be available in 1GHz and 800MHz versions in a 783 pin, 29 x 29mm FC-PBGA (flip-chip plastic ball grid array) package.

General sampling is planned for the third quarter of 2006.

Suggested resale pricing in 10,000-unit quantities starts at US $180.

An impressive array of top executives from leading industry players will address the seventh VIA Technology Forum (VTF2006) in Taipei from Wednesday 7th June to Friday 9th June 2006.
An impressive array of top executives from leading industry players will address the seventh VIA Technology Forum (VTF2006) in Taipei from Wednesday 7th June to Friday 9th June 2006. VTF2006 will be opened by Wenchi Chen, President and CEO of VIA, who will expand on VIA’s leadership in developing exciting new technologies that are driving the proliferation of digital intelligence. The keynote session will also feature Phil Hester, Corporate Vice President and Chief Technology Officer at AMD, and Microsoft’s Otto Berkes, Ultra-Mobile PC General Manager, who will highlight the latest trends in x86 performance and software development that together are facilitating the digital-everywhere world we are entering.

More than 20 high-level executives from key organisations including AMD, ASE, Citrix, HP and Microsoft will offer insights into how the computing, communications, applications and content communities can work together in creating ground-breaking new usage models.

This broad cross-industry support reflects the value of the forum in examining the key trends in strategic personal, business and emerging market technologies.

‘VTF continues to provide the leadership and direction required for the industry to design and develop our digital world of tomorrow’, said Richard Brown, Vice President Corporate Marketing, VIA Technologies.

‘We look forward to hosting an exciting program of covering the hottest topics and fastest growing markets in the industry, as well as key areas of technology innovation’.

Two new high-speed Flash microcontrollers suit motor control, induction heating and other industrial and consumer applications that require 100DMIPS performance and excellent real-time behaviour.
Renesas Technology Europe has announced two new high-speed Flash microcontrollers for motor control, induction heating and other industrial and consumer applications that require 100DMIPS performance and excellent real-time behaviour. The SH7146F and SH7149F also have a large timer resource and triple ADC that allows two motors to be driven from a single device. This results in a major cost reduction compared with systems with one microcontroller per motor.

Joachim Hupper, Marketing Specialist in the Consumer/Industrial Division of Renesas Technology Europe, explains: ‘With 256Kbyte of zero-wait Flash memory these devices target the heartland of high end embedded microcontrollers, but offer new levels of performance and real-time response speed at cost levels lower than ever before’.

‘The microcontrollers also feature triple ADC to support advanced motor control performance, even at high motor speed, when two ADC are not enough’.

The SH7146F and SH7149F are built using Renesas Technology’s MONOS (metal oxide nitride oxide silicon) Flash technology, the industry’s fastest embedded Flash technology with read access times of just 12.5ns.

The central nitride enables small cell sizes, resulting in high read access performance at low cost levels.

Both devices have two advanced timer units called the MTU2 and the MTUS2S.

The MTU2 has six channels of 16bit timers that can be used for general-purpose timer tasks and for driving an electrical three-phase motor simultaneously.

For this, the timer generates the required six-phase PWM, has an emergency hardware shutdown input and understands quadrature encoder feedback.

The MTU2S is a subset of the MTU2, namely the part of it that has the motor control capability.

Hence, all SH microcontrollers with both the MTU2 and the MTU2S can drive two electrical motors.

The SH7146F and SH7149F each have 256Kbyte of MONOS Flash, which supports 5V/80MHz zero-wait operation.

The devices also have 8Kbyte RAM and a peripheral set comprising a data transfer controller (DTC) for flexible and autonomous data movements, three serial ports, a watchdog, an additional compare-match timer and up to 63 IO lines.

The SH7146F is available now in an 80-pin QFP and the SH7149F is available in a 100-pin QFP with an 8bit external bus option to connect external peripherals.

Both packages are RoHS compliant.

The devices are supported by Renesas’ popular E10A-USB on-chip debugger and an evaluation board.

A new miniature version of the BelaSigna 200 audio processing chip is optimised for use in advanced small-form-factor precision audio products for consumer and industrial markets.
AMI Semiconductor has developed a new miniature version of its BelaSigna 200 audio processing chip, optimising the technology for use in advanced small-form-factor precision audio products for the consumer and industrial markets. The product has been developed based on a new miniature chip-scale package (CSP) measuring 3.8 x 2.4mm, approximately one-seventh the size of the previously available QFN package. BelaSigna 200 interfaces seamlessly with wireless technology including Bluetooth subsystems and consumes only a few milliamps of current at 1.8V.

It contains a DSP core, stereo codec, memory, power management, and a highly efficient, hardware-based WOLA filter-bank coprocessor, which greatly reduces power consumption and chip sise while providing low group delay and adjustable parameters for easy integration into a wide range of designs.

‘We have witnessed good success with BelaSigna 200 since its market introduction’.

‘It is the most complete, lowest power and smallest programmable audio processing system available, which also offers the flexibility of a generic DSP system at the size and power consumption of a dedicated ASIC’, said David Coode, Manager of AMI Semiconductor’s Audio Group.

‘The new miniaturised version enables our customers to design BelaSigna 200 into even smaller products’.

Currently, BelaSigna 200 is targeted for use in small-form-factor precision digital speech- and audio-centric products such as wireless headsets and headphones.

These popular devices continue to shrink in size to become more discreet and comfortable to wear.

Semiconductor distribution specialist Silica has successfully collaborated with Philips and deployed the first RosettaNet Partner Interface Processes between the companies.
Semiconductor distribution specialist Silica, an Avnet company, has successfully collaborated with Philips and deployed the first RosettaNet Partner Interface Processes between the companies. Following a similar successful implementation with Texas Instruments, the RosettaNet exchange with Philips is another important milestone for the demand creation process. The automation of design registration business processes between Silica and Philips provides increased flexibility and cost-efficiency throughout the supply chain.

By providing an easy to use registration process, requiring minimal administration, Silica and Philips are now able to enhance the support of customers’ strategic design goals.

Moreover, the implementation demonstrates the continuous commitment of both companies to accelerate and improve the supply chain for its OEM and CEM customers.

‘By implementing the RosettaNet 5Cx series PIPs with Philips, we’ve completely automated the process of sharing lists of our parts eligible for design registration, migrating from a more complex and time consuming process’, said Tesfay Embaye, Silica’s VP Technical Marketing.

‘Our field application engineers are taking full advantage of the new process and we see first-hand improvements in operational efficiency and reductions in process times’.

‘Benefits, we directly pass on to our customers’, Embaye says.

Silica will continue its strong commitment to the RosettaNet standards by leveraging it with further suppliers in the very near future.

Silica will continue its strong commitment to the RosettaNet standards by leveraging it with further suppliers in the very near future.

RosettaNet is an independent consortium of supply chain partners in the high-tech industry, supports development and rapid deployment of supply chain e-business standards based on XML for the high-tech supply chain.