Available now from Caddock Electronics, the USF300 Series of ultrastable low-TC ultraprecision film resistors has been developed for use in the most demanding precision analogue electronics applications. The USF300 Series provides the widest resistance range - 50ohm to 25Mohm - for a low-TC resistor product available in the industry. Maximum temperature coefficient is 5ppm/C from -40 to +85C.

The USF300 Series is available in three models with voltage and power ratings of 300V/0.33W, 1400V/0.75W and 2500V/0.75W.

For ultralow TC Caddock offers the USF200 Series with a maximum temperature coefficient of 2 ppm/C from -40 to +85C.

The USF300 Series resistors are manufactured with an alumina (aluminium oxide) ceramic sandwich that offers exceptional thermal performance.

The excellent thermal conductivity of the alumina sandwich construction provides good heat flow away from the resistor element minimising the temperature rise in the resistor due to power dissipation as compared with ‘plastic package’ low-TC resistors.

This provides extremely stable operating performance as power is applied to the low-TC resistor.

USF300 Series resistors are available in standard resistance values that are used in high accuracy, precision analogue designs.

Typical applications include amplifier gain setting, bridge circuits, weighing systems, strain gauge circuits, reference resistors, and precision voltage dividers with input voltages up to 2500V.

Surface mount conductive polymer capacitors combine ultralow equivalent series resistance with the lowest inductance available on the market for products of this type.

Kemet has launched a new series of face down termination conductive polymer capacitors. The new surface mount devices combine ultralow equivalent series resistance (ESR) with the lowest inductance (ESL) available on the market for products of this type. Initial offerings of the T528 series, which specifies an inductance of less than 0.7nH at 20MHz, are targeted at high-speed server and microprocessor decoupling applications that are driving demand for low inductance parts.

Featuring terminations on the underside of the component as opposed to standard wrap-around terminations, the T528 series is initially being offered with a 330uF capacitance and rated voltage of 2.5V.

A choice of 9 or 12mohm ESR parts is available.

Both are housed in low profile Z-size cases measuring 7.3 x 4.3mm and with a height of just 1.7mm.

The new polymer capacitors feature a nonignition failure mode and a self-healing mechanism.

They are RoHS compliant and suitable for use over a temperature range of -55 to +105C.

Parts are available in tape and reel packaging ready for use in automated assembly processes.

New from Link Microtek is a family of surface-mount clock oscillators and VCXOs that not only offer high performance but are available with exceptionally short lead times.

New from microwave and RF component specialist Link Microtek is a family of surface-mount clock oscillators and VCXOs that not only offer high performance but are available with exceptionally short lead times of typically 2 weeks or less. Manufactured by MtronPTI, the M210x series clock oscillators and M310x series VCXOs utilise the company’s ‘QiK Chip’ ASIC-based technology to deliver a wide frequency range of 150MHz to 1.4GHz and a low integrated jitter value of typically 0.3ps, which is comparable with more expensive SAW-technology alternatives. In terms of thermal stability, the new devices outperform SAW equivalents: using a standard AT-cut crystal resonator, the QiK Chip products achieve stabilities of +/-20ppm over the industrial temperature range of -40 to +85degC, compared with typical values of +/-100ppm over the more limited range of -20 to +70degC for SAW-based oscillator designs.

Fully RoHS compliant, the M210x clock oscillators and M310x VCXOs are available in either 7 x 5mm leadless or 14 x 9mm J-lead ceramic packages andcan be specified with supply voltages of 1.8V, 2.5V or 3.3V and a choice of LVPECL, LVDS or CML compatible outputs.

The combination of high performance and short lead times is expected to make the new devices particularly attractive for applications such as high-speed Ethernet, microwave radios, advanced Sonet systems, and high-precision test and measurement equipment.

TDK Corporation has announced that production of the MLG0402 chip coils, the industry’s smallest multilayer ceramic chip coils.

TDK Corporation has announced that production of the MLG0402 chip coils, the industry’s smallest multilayer ceramic chip coils, will begin in July 2006. The inductors, designed for ultra high frequency, represent a major breakthrough in miniaturization with approximately 70% less volume and 55% less mounting area than the 0603-sized coils currently in widespread use. The components also offer an excellent inductance range, up to a maximum of 12 nH.

The size of the new coils will make possible further miniaturization of the module and narrow pitch mounting of numerous devices including cell phones, DECT handsets, high-frequency modules, Bluetooth devices, W-LANs, and digital television tuners.

The components will also allow the addition of new functions to the high-frequency circuit components of various devices in the mobile communications field.

In conjunction with the rapid miniaturization of mobile communications devices such as cell phones as well as the incorporation of multiple functions, there have been strong demands for chip coils to be made more compact.

In response to these calls, TDK has employed its expertise in material and multilayering technologies to develop the industry’s first 0402-sized multilayer ceramic high-frequency chip coils.

As well as its compact size, the chip coils offer excellent inductance values, one of the most important characteristics of components used in high-frequency applications.

The MLG0402 series comprises 14 products with inductances from 1.0 nH to 12 nH, allowing set manufacturers to select the ideal coil according to the specific application.

The MLG0402 chip coils measure 0.4 x 0.2 x 0.2 mm (all dimensions +/- 0.02 mm) with tolerance of +/- 0.3 nH and +/- 5%, operating temperature range -55 to +125 deg, and storage temperature range of -55 to +125C.

The components do not include any lead or lead compounds and are suitable for use with lead-free solder, making them RoHS-compliant, completely lead-free products.

RS continues to support the engineers of tomorrow by taking pole position at the Formula Student Finals.

RS took a leading role in this year’s Formula Student finals at Bruntingthorpe, Leicestershire held between the 5th and 8th July. As well as sponsoring three of the most prestigious awards, RS also became a full partner of IMechE, which organises the event, giving RS an important say in steering the future direction of the competition. Several RS regional sales teams also participated in the event by supporting local universities financially and by the donation of components, as well as offering discounts and support from RS’ free technical help-line.

These sales teams include the Leeds Trade Counter which supported the University of Leeds’ entrant, which this year won the Sprint Time Trial beating off competition from around the world.

Formula Student is a competition designed to promote excellence in engineering by challenging university students to design, build, develop, market and compete as a team with a small single-seat racing car.

The competition has been so successful that 40 universities from the UK and a similar number of universities from the rest of the world are participating in this year’s event.

The competition is supported by the motor racing industry as well as universities, with Ross Brawn, Technical Director of the Ferrari Formula 1 team, the Patron of Formula Student.

Renault F1 director Paul Simmons also took an active part in this year’s event by welcoming students and providing support to the event.

Both Audi and Ferrari are active participants and sponsor local universities.

RS continued this theme by inviting James Hewer Design Engineer from 888 Engineering, the race management team for Vauxhall’s VX racing team who compete in the British Touring Car Championship, to present the prize for endurance to Oxford Brookes University.

Hewer was himself a Formula Student competitor before starting his highly successful career in the industry.

The other winners of RS sponsored prizes were the University of Leeds who won the prize for the sprint event and the University of Patras from Greece who won the prize for overall Class B winner.

‘RS are proud to be associated with this event which is important practical experience for the next generation of motor racing engineers’, said Graham Johnson, UK Marketing Manager at RS.

He continues, ‘The students get the same first class service that all our regular customers receive, free support, guaranteed stock availability, guaranteed compliance to relevant standards and next day delivery available on over 135,000 components’.

James Hewer commented, ‘As well as being technically challenging, Formula Student also teaches many skills not offered by universities, for example teamwork and communication’.

‘While university offered the academic skills, this event provided the whole range of practical skills required to gain my dream job as an automotive racing designer, and as such I am delighted to be back here with RS to support this year’s competition’.

Cathy A Whittaker has joined the executive team at Sager Electronics, the electronic distribution industry’s leading privately held, employee-owned company.

Cathy A Whittaker has joined the executive team at Sager Electronics, the electronic distribution industry’s leading privately held, employee-owned company. As Vice President for Strategic Sales, Whittaker will be responsible for driving growth of the company’s key strategic accounts. ‘A significant element of Sager’s sales strategy is our focus on growing strategic accounts through a combination of products and services’.

‘Cathy is exceptionally skilled at delivering both to this targeted customer base’, stated Sager President Frank Flynn.

Flynn continued: ‘Cathy’s experience managing and growing key North American accounts as well as her ability to drive technologically based supply chain solutions makes her a natural fit to lead our strategic account programme’.

In a career spanning over 25 years in the electronics industry, Whittaker is a recognised leader in the areas of sales, marketing and supply chain management.

Prior to joining Sager Electronics, Whittaker most recently held the roles of Vice President Sales, Regional Accounts and Vice President Digital Supply Chain Solutions for Arrow Electronics.

Premier Farnell and STMicroelectronics have concluded an agreement allowing Premier Farnell’s subsidiaries to actively promote and sell products from STMicroelectronics via the worldwide web.

Premier Farnell and STMicroelectronics have concluded an agreement allowing Premier Farnell’s subsidiaries Farnell InOne in Europe and Newark InOne in the USA to actively promote and sell products from STMicroelectronics, leveraging Premier Farnell’s regional presence and reach via the worldwide web. Both companies are excited by the opportunity to use Premier Farnell’s renowned logistics platform and ease of order placement, with STMicroelectronics desire to promote the broadest semiconductor capability quickly to designers, and other users. A previously extensive and diverse range of products from STMicroelectronics has been significantly expanded and updated to meet their joint objectives of serving the widest customer base and design needs.

Jack Dauber, STMicroelectronics Distribution Vice President Europe, comments: ‘We are pleased to conclude this agreement with Premier Farnell, complementing our efforts to give to our global design community the ability to source STMicroelectronics products quickly and easily’.

Marianne Culver, Group Director, Global Supplier Management, Farnell InOne, adds: ‘We’re looking forward to working even more closely with STMicroelectronics’.

‘By optimising our web-based marketing tools as well as catalogue and paper-based direct marketing tools we are able to give the STMicroelectronics portfolio a truly global reach’.

‘The current product offering across each region has been designed specifically to serve the needs of customers in each area’.

‘Our web based catalogue allows for quick and easy ordering wherever our customers are based’.

Thick-film-on-ceramic resistor-capacitor chip networks replace up to 16 discrete components using just 50% of the PC board space, with no need for diode protection.

Providing design engineers with an R-C network that replaces up to 16 discrete components using just 50% of the PC board space, TT electronics’ BI Technologies SMT Division has developed a series of resistor-capacitor chip networks. Designated the RC Series, the thick-film-on-ceramic chip networks are not susceptible to ESD (electrostatic discharge), and do not require diode protection. According to Jim Rieley, Sales Director for BI Technologies’ SMT Division, the chip networks provide real estate savings of 50% versus discrete components.

‘Many designs can use one RC network instead of 16 discrete components’, explained Rieley, ‘and this reduced component count saves on PC board space, pick and place costs, as well as inventory and bill of material costs’.

‘In addition, reducing the number of solder joints and traces on the PC board improves overall reliability’.

‘The RC networks can be placed close to active devices, thus reducing PC board routing problems and minimising inductance of long traces on the circuit boards’, Rieley continued.

The R-C chip networks are ideal for a variety of circuits, including line terminations, and EMI, keypad, ECG input, parallel port, serial port, SCART port, keyboard and mouse, and control and data line filters, in laptop and notebook computers, workstations, multimedia applications, automotive electronics, computer peripherals, cellular phones and set top box applications.

The low profile RC Series is also ideal for PCMCIA applications.

The RC Series devices are available as a single chip in 1206 size, as well as in five different circuit configurations in a ten- terminal 2512 array.

Power ratings for the RC Series are 63mW per resistor (250mW packaging rating).

Resistance range for the networks is 20ohm to 1Mohm, with standard tolerance of +/-20% (10% and 5% tolerances also available).

Capacitor dielectric is X7R with a tolerance of +/-20%.

TCRs are +/-200ppm/C (optional TCRs at +/-100ppm/C are also available).

BI Technologies will also produce devices outside these specifications to meet customer requirements, with comprehensive application engineering and design support available for customers worldwide.

Typical pricing for the RC6 chip networks starts at $0.18 in quantities of 10,000.

Datatronic Distribution has been supplying RoHS-compliant products since May 2005, and all standard products have been RoHS-compliant.

As a global leader in the design and manufacture of high reliability industrial and commercial magnetic components, Datatronic Distribution is committed to preserving the environment and acting responsibly to meet the European Union’s 20002/95/EC - WEEE directives on the Reduction of hazardous substances (RoHS). ‘We are proud to announce that all standard catalogue transformer and inductor part numbers are now in compliance with the EU’s RoHS regulations’. ‘This process required extensive efforts within our engineering and manufacturing groups’.

‘It demonstrates our strong commitment to the environment and customers in Europe and worldwide’, said Randy Eller, Vice President, Sales and Marketing.

The company has been supplying RoHS-compliant products since May 2005, and all standard products have been RoHS-compliant since 31st May 2006.

‘This effort signifies Datatronic Distribution’s commitment to meeting the RoHS initiatives and to providing fully compliant products to our customers well ahead of the industry mandated deadline’, Eller said.

The standard solder now employed by Datatronic is Sn96Ag4, with Sn100 and Sn99.3Cu0.7 solders also available on request.

The company is denoting compliance on its product data sheets with a special RoHS logo that indicates the product is designed and manufactured with lead-free solder and does not contain levels of lead, cadmium, mercury, hexavalent chromium, polybrominated biphenyls (PBBs) or polybrominated ethers (PBDEs) prohibited by RoHS/WEEE directives.

The EU’s RoHS directive excludes all devices designed for use in military, medical and aerospace applications, such as those manufactured by the company’s other magnetics business unit Datatronics Romoland For those customers with these applications who feel their products must still meet RoHS requirements and require lead solder terminations, the company has developed a program to issue special part numbers for equivalents to their standard products.

For custom part numbers in other industrial or commercial applications, Datatronic Distribution has developed a similar review program.

The company is working with customers to review their documentation, drawings, designs and materials on a case-by-case basis.

Land grid array capacitors achieve the equivalent high-frequency performance of complex eight-terminal interdigitated capacitors in a simple two terminal device.

Thanks to patented design innovations, land grid array (LGA) capacitors from AVX achieve the equivalent high-frequency performance of complex eight-terminal interdigitated capacitors (IDCs) in a simple two terminal device. Using a new fine copper termination construction process and modified internal design, LGA decoupling capacitors reduce internal inductance by 50% compared with capacitors using more traditional reverse geometry or the multiterminal IDC construction design. A two-terminal LGA capacitor using this process can achieve inductances down to 35pH.

This feature is especially important in semiconductor package-level decoupling applications where capacitors are placed on or very close to the processor die.

LGA capacitors reduce inductance by making the current loop of the mounted device as small as possible.

This is achieved by using vertical electrodes which can be terminated very close to the centre of the finished device.

Using land grid array terminations and designing the via connections underneath the device package will also reduce this current.

The pad requirements of the LGA can enable designers to place an 0204 capacitor into a similar PCB board area of a 0201 traditionally terminated MLCC, thereby significantly increasing the capacitance in the circuit.

There are four package versions in the initial product release, LG12 (0204), LG22 (0306), LG32 (0508) and LGC2 (0805).

The LC32 package offers typical inductances down to under 30pH.

At 4V, the LG12 has capacitance values up to 0.10uF, and the LG22 up to 0.47uF.