Eight new NanoSwitch digital bus switch products are ideally suited to address the operational requirements of next generation servers, RAID, Super VGA, memory bank switching and telecomms backplanes
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Eight new NanoSwitch digital bus switch products are ideally suited to address the operational requirements of next generation servers, RAID, Super VGA, memory bank switching, and high-performance networking/telecomms backplanes. The PI3CH family of low-voltage (2.5/3.3V), high-bandwidth (500MHz) bus switches offer expanded performance capabilities that meet the challenges of advanced performance communication buses like PCI-X, as well as emerging DDR-I / DDR-2 memory standards, and also simplifies the I/O migration from parallel to serial differential signalling standards.

Key performance features in this product family include very flat on-resistance (5ohm - flat) across the full device bandwidth, and very low on/off capacitance (5-10pF) that enables the switches to be used in applications to reduce bus loading.

The 5V I/O tolerance and beyond rail-to-rail capability makes the PI3CH switches ideal for bridging legacy 5V I/O based platforms to next generation 2.5/3V systems.

“Pericom’s number-one position in digital bus switches over the past two consecutive years has provided us with an intimate perspective on the industry, and has enabled us to focus our technology to help drive unparalleled performance levels”, explained Jeff DeAngelis, Director of Product Marketing.
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“This product line extension helps rejuvenate the design engineer’s toolbox by offering new performance alternatives never believed possible in digital bus switch technology”.

Key features include: high signal passing bandwidth (500MHz); beyond rail-to-rail switching; 5V tolerant I/O with 3.3V supply; 2.5 and 3.3V supply voltage operation; hot-insertion capable; industrial operating temperature -40 to +85C; and lead-free packaging available.

Free product samples, datasheets, Ibis models, technical support, product presentation, and application note are available today on the company website.

The devices are housed in a variety of performance and space saving packaging ranging from TSSOP to ultracompact TDFN.