CoolFin heatsinks allow designers to reduce weight and save space while maximising thermal efficiency.
CoolFin heatsinks from Molex allow designers to reduce weight and save space while maximising thermal efficiency. The 37430 series heatsinks are designed to provide superior cooling for Pentium 4 FMB2 microprocessors running at speeds of 3.06GHz and higher. The CoolFin heatsink features stamped fins that are linked together and soldered to a baseplate.

The inner fins, which sit directly above the heat source, are made of copper for maximum thermal efficiency.

The outer fins are made of aluminium to reduce weight.

CoolFin technology offers a broad range of choices in fin pitch, geometry, material type and thickness.

Molex heatsinks are available in multiple fan speeds for motherboards without variable fan speed technology, matching cooling requirements with acoustic needs.