Picoflex Vertical SMT headers from Molex can withstand reflow at temperatures up to 260C

Picoflex Vertical SMT headers from Molex are specifically designed for compatibility with the latest lead-free soldering processes and can withstand reflow at temperatures up to 260C. The headers, which are rated at 2.4A per circuit at up to 250V, have a pitch of 1.27mm and are available in a choice of standard and low-profile versions.

The insulant used in the new Picoflex headers is fully compatible with the stringent demands of the glow-wire test prescribed by IEC60335 and is self-extinguishing in line with the requirements of UL94V-0.

The headers are therefore an ideal and cost-effective choice for use in a wide range of applications - including white goods, medical, and industrial equipment - where suitability for unattended operation is essential.

Fully compatible with standard connectors in the Picoflex range, the new headers can be supplied with tin or gold-plated contacts, and are available in versions with between 4 and 26 circuits.

Other options include printed circuit board pegs for positive location, and a choice of tube or tape-on-reel packaging.

When used in conjunction with Molex Picoflex discrete wire connectors, which incorporate finger tabs for easy tool-free mating, the new headers have a maximum mating force of 1.7N for tin-plated types, and 1.1N for gold-plated versions.

They are designed for applications requiring occasional mating and unmating and have a minimum durability of 30 cycles for tin and 100 cycles for gold.

The operating temperature range for Molex Picoflex headers is -40C to +105C.

Used with Picoflex discrete wire connectors, they have a maximum contact resistance of 15 milliohm, a di-electric withstand voltage of 750V AC and a minimum insulation resistance of 1,000Mohm.