Hi-Flow 225UF has been developed in response to the high power digital interface market’s need for a high-performance, reworkable phase change material.
Developed in response to the high power digital interface market’s need for a high-performance, reworkable phase change material, Hi-Flow 225UF interface material combines superior thermal performance with ease of handling. Hi-Flow 225UF uses a special “non-tack” formula of Bergquist’s field-proven Hi-Flow 225U compound to eliminate adhesive bleed-out while providing low thermal resistance. The phase change compound is bonded to a conformable aluminium foil to provide a compliant, easy-release characteristic that simplifies rework at the heatsink level by leaving the surface clean and residue-free.

Typical applications for Hi-Flow 225UF include heatsink/CPU interfaces in games consoles, set top boxes, hubs, workstations and high-end computers, as well as special applications requiring rework or repair at the factory or subcontracting level.

Hi-Flow 225UF is offered in a standard 4mm thickness (1mm foil coated with 3mm phase change compound) and can be supplied in kiss-cut and sheet form as well as square and rectangular “digital standard part” formats.