Two new phase change thermal interface materials provide a clean and effective alternative to messy thermal grease.
Two new phase change thermal interface materials provide a clean and effective alternative to messy thermal grease. Thermflow T454 and T506 consist of an electrically nonconductive dry film that softens at device operating temperatures to provide a thin, thermally efficient interface between a component and heatsink or other heat-dissipating surface. T454 has a thickness of 0.13mm and is designed for use in applications where the mating parts have smooth surfaces.

T506 is 0.25mm thick and is suited to applications with larger surface areas or poor flatness.

Both materials are free films with no carrier; this helps to ensure a minimum thickness bond line and maximum thermal performance.

Thermflow T454 and T506 have a phase change temperature of just 43C, this is particularly beneficial in applications where components do not reach the higher phase change temperatures of between 50 and 58C associated with some competing materials.

Optimum thermal performance is achieved under clip or fastener pressures between 34 and 414kPa.

Parts are carried on a clear liner and supplied in roll format either kiss-cut or in a continuous format.

The materials also have a top blue liner that can be easily removed by means of a pull-tab once the pad is in place on the device or heatsink.

Both standard and custom shapes are available.