A dual high-voltage transistor (BF485PN) in the SC74 (SOT457) mini surface-mount package has been launched by Philips Semiconductors.

Targeted at the comms market, the next-generation device makes it possible to replace two large SOT54 leaded packages with a single, much smaller, surface mount device. This is also said to save on board space.

Used for the phone hookswitch, the device has the latest lead frame which has an improved power dissipation of 600mW.