Molex’ Mini-Fit RTC vertical headers can withstand high SMT solder-reflow temperatures and are compatible with lead-free RoHS reflow processes

Molex has released the 4.20mm pitch Mini-Fit RTC (RoHS Temperature Capable) vertical headers, providing a cost-effective solution for mid-range power applications that require high density and current carrying capability. Designed with a high-temperature LCP housing that can withstand high SMT solder-reflow temperatures, the headers guarantee compatibility with lead-free RoHS reflow processes.

In addition, the press-fit PCB pegs provide polarisation during placement on the board and increased retention during the soldering process.

The Mini-Fit RTC headers share the same features of the Mini-Fit Jr headers, ensuring even greater compatibility and reliability.

The Mini-Fit key design allows it to mate with standard Mini-Fit receptacles.

Design flexibility is ensured through the choice of four to 12 and 24 circuit configurations.

The improved Mini-Fit Plus HCS male pins provide up to 12A per circuit when mated with the 16AWG Mini-Fit Plus HCS female crimp terminal.

The elliptical contact dimple design increases durability, doubling to tripling the number of mating cycles that standard Mini-Fit terminals will survive.

Terminals are available in post-plated versions only, enhancing the electrical performance and minimising the contact resistance of the mating interface.

The gold-plated terminals are suitable for ‘hot-pluggable’ applications.